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Grade M30C Nickel vs. C96300 Copper-nickel

Grade M30C nickel belongs to the nickel alloys classification, while C96300 copper-nickel belongs to the copper alloys. They have 53% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade M30C nickel and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
130
Elongation at Break, % 29
11
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 61
49
Tensile Strength: Ultimate (UTS), MPa 510
580
Tensile Strength: Yield (Proof), MPa 250
430

Thermal Properties

Latent Heat of Fusion, J/g 290
230
Maximum Temperature: Mechanical, °C 900
240
Melting Completion (Liquidus), °C 1290
1200
Melting Onset (Solidus), °C 1240
1150
Specific Heat Capacity, J/kg-K 430
400
Thermal Conductivity, W/m-K 22
37
Thermal Expansion, µm/m-K 13
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 60
42
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.5
5.1
Embodied Energy, MJ/kg 140
76
Embodied Water, L/kg 250
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
59
Resilience: Unit (Modulus of Resilience), kJ/m3 200
720
Stiffness to Weight: Axial, points 10
8.2
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 16
18
Strength to Weight: Bending, points 16
17
Thermal Diffusivity, mm2/s 5.7
10
Thermal Shock Resistance, points 18
20

Alloy Composition


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Carbon (C), % 0 to 0.3
0 to 0.15
Copper (Cu), % 26 to 33
72.3 to 80.8
Iron (Fe), % 0 to 3.5
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.5
0.25 to 1.5
Nickel (Ni), % 56.6 to 72
18 to 22
Niobium (Nb), % 1.0 to 3.0
0.5 to 1.5
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 1.0 to 2.0
0 to 0.5
Sulfur (S), % 0 to 0.030
0 to 0.020
Residuals, % 0
0 to 0.5