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Grade M30H Nickel vs. Solder Alloy 162

Grade M30H nickel belongs to the nickel alloys classification, while solder alloy 162 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is solder alloy 162.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
35
Elongation at Break, % 11
36
Poisson's Ratio 0.32
0.4
Shear Modulus, GPa 61
12
Tensile Strength: Ultimate (UTS), MPa 770
41

Thermal Properties

Latent Heat of Fusion, J/g 320
44
Melting Completion (Liquidus), °C 1250
220
Melting Onset (Solidus), °C 1200
180
Specific Heat Capacity, J/kg-K 440
180
Thermal Conductivity, W/m-K 22
47
Thermal Expansion, µm/m-K 13
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
11
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
10

Otherwise Unclassified Properties

Density, g/cm3 8.6
9.3
Embodied Carbon, kg CO2/kg material 7.7
9.4
Embodied Energy, MJ/kg 110
160
Embodied Water, L/kg 250
830

Common Calculations

Stiffness to Weight: Axial, points 10
2.1
Stiffness to Weight: Bending, points 21
12
Strength to Weight: Axial, points 25
1.2
Strength to Weight: Bending, points 22
2.8
Thermal Diffusivity, mm2/s 5.7
28
Thermal Shock Resistance, points 27
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
1.2 to 1.6
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 3.5
0 to 0.020
Lead (Pb), % 0
47.3 to 49.3
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0 to 0.010
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 2.7 to 3.7
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010