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Grade M30H Nickel vs. Solder Alloy 402

Grade M30H nickel belongs to the nickel alloys classification, while solder alloy 402 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is solder alloy 402.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
52
Elongation at Break, % 11
20
Poisson's Ratio 0.32
0.36
Shear Modulus, GPa 61
19
Tensile Strength: Ultimate (UTS), MPa 770
57

Thermal Properties

Latent Heat of Fusion, J/g 320
64
Melting Completion (Liquidus), °C 1250
310
Melting Onset (Solidus), °C 1200
230
Specific Heat Capacity, J/kg-K 440
230
Thermal Conductivity, W/m-K 22
61
Thermal Expansion, µm/m-K 13
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
15
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
18

Otherwise Unclassified Properties

Density, g/cm3 8.6
7.3
Embodied Carbon, kg CO2/kg material 7.7
15
Embodied Energy, MJ/kg 110
250
Embodied Water, L/kg 250
1180

Common Calculations

Stiffness to Weight: Axial, points 10
3.9
Stiffness to Weight: Bending, points 21
17
Strength to Weight: Axial, points 25
2.2
Strength to Weight: Bending, points 22
4.5
Thermal Diffusivity, mm2/s 5.7
37
Thermal Shock Resistance, points 27
3.6

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
2.5 to 3.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 3.5
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0 to 0.010
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 2.7 to 3.7
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.030
0
Tin (Sn), % 0
95.9 to 97.5
Zinc (Zn), % 0
0 to 0.0010