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Grade M30H Nickel vs. C15500 Copper

Grade M30H nickel belongs to the nickel alloys classification, while C15500 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is C15500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 11
3.0 to 37
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 61
43
Tensile Strength: Ultimate (UTS), MPa 770
280 to 550
Tensile Strength: Yield (Proof), MPa 470
130 to 530

Thermal Properties

Latent Heat of Fusion, J/g 320
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1250
1080
Melting Onset (Solidus), °C 1200
1080
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 22
350
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
90
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
91

Otherwise Unclassified Properties

Base Metal Price, % relative 50
33
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 7.7
2.7
Embodied Energy, MJ/kg 110
42
Embodied Water, L/kg 250
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 75
15 to 84
Resilience: Unit (Modulus of Resilience), kJ/m3 700
72 to 1210
Stiffness to Weight: Axial, points 10
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 25
8.6 to 17
Strength to Weight: Bending, points 22
11 to 17
Thermal Diffusivity, mm2/s 5.7
100
Thermal Shock Resistance, points 27
9.8 to 20

Alloy Composition


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Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
99.75 to 99.853
Iron (Fe), % 0 to 3.5
0
Magnesium (Mg), % 0
0.080 to 0.13
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0
Phosphorus (P), % 0 to 0.030
0.040 to 0.080
Silicon (Si), % 2.7 to 3.7
0
Silver (Ag), % 0
0.027 to 0.1
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.2