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Grade M30H Nickel vs. C17200 Copper

Grade M30H nickel belongs to the nickel alloys classification, while C17200 copper belongs to the copper alloys. They have a modest 31% of their average alloy composition in common, which, by itself, doesn't mean much. There are 27 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is C17200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 11
1.1 to 37
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 61
45
Tensile Strength: Ultimate (UTS), MPa 770
480 to 1380
Tensile Strength: Yield (Proof), MPa 470
160 to 1250

Thermal Properties

Latent Heat of Fusion, J/g 320
230
Maximum Temperature: Mechanical, °C 900
280
Melting Completion (Liquidus), °C 1250
980
Melting Onset (Solidus), °C 1200
870
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 22
110
Thermal Expansion, µm/m-K 13
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
22
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
23

Otherwise Unclassified Properties

Density, g/cm3 8.6
8.8
Embodied Carbon, kg CO2/kg material 7.7
9.4
Embodied Energy, MJ/kg 110
150
Embodied Water, L/kg 250
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 75
4.2 to 500
Resilience: Unit (Modulus of Resilience), kJ/m3 700
110 to 5720
Stiffness to Weight: Axial, points 10
7.6
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 25
15 to 44
Strength to Weight: Bending, points 22
16 to 31
Thermal Diffusivity, mm2/s 5.7
31
Thermal Shock Resistance, points 27
16 to 46

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
1.8 to 2.0
Carbon (C), % 0 to 0.3
0
Copper (Cu), % 27 to 33
96.1 to 98
Iron (Fe), % 0 to 3.5
0 to 0.4
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 57.9 to 70.3
0.2 to 0.6
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 2.7 to 3.7
0 to 0.2
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.5