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Grade M30H Nickel vs. C96300 Copper-nickel

Grade M30H nickel belongs to the nickel alloys classification, while C96300 copper-nickel belongs to the copper alloys. They have 52% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is grade M30H nickel and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
130
Elongation at Break, % 11
11
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 61
49
Tensile Strength: Ultimate (UTS), MPa 770
580
Tensile Strength: Yield (Proof), MPa 470
430

Thermal Properties

Latent Heat of Fusion, J/g 320
230
Maximum Temperature: Mechanical, °C 900
240
Melting Completion (Liquidus), °C 1250
1200
Melting Onset (Solidus), °C 1200
1150
Specific Heat Capacity, J/kg-K 440
400
Thermal Conductivity, W/m-K 22
37
Thermal Expansion, µm/m-K 13
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 50
42
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 7.7
5.1
Embodied Energy, MJ/kg 110
76
Embodied Water, L/kg 250
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 75
59
Resilience: Unit (Modulus of Resilience), kJ/m3 700
720
Stiffness to Weight: Axial, points 10
8.2
Stiffness to Weight: Bending, points 21
19
Strength to Weight: Axial, points 25
18
Strength to Weight: Bending, points 22
17
Thermal Diffusivity, mm2/s 5.7
10
Thermal Shock Resistance, points 27
20

Alloy Composition


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Carbon (C), % 0 to 0.3
0 to 0.15
Copper (Cu), % 27 to 33
72.3 to 80.8
Iron (Fe), % 0 to 3.5
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0 to 1.5
0.25 to 1.5
Nickel (Ni), % 57.9 to 70.3
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0 to 0.030
0 to 0.020
Silicon (Si), % 2.7 to 3.7
0 to 0.5
Sulfur (S), % 0 to 0.030
0 to 0.020
Residuals, % 0
0 to 0.5