H02 C10300 Copper vs. H02 C12900 Copper
Both H02 C10300 copper and H02 C12900 copper are copper alloys. Both are furnished in the H02 (half hard) temper. Their average alloy composition is basically identical. There are 31 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.
For each property being compared, the top bar is H02 C10300 copper and the bottom bar is H02 C12900 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 120 |
| Elongation at Break, % | 14 | |
| 14 |
| Poisson's Ratio | 0.34 | |
| 0.34 |
| Rockwell F Hardness | 83 | |
| 84 |
| Rockwell Superficial 30T Hardness | 50 | |
| 50 |
| Shear Modulus, GPa | 43 | |
| 43 |
| Shear Strength, MPa | 170 | |
| 180 |
| Tensile Strength: Ultimate (UTS), MPa | 290 | |
| 290 |
| Tensile Strength: Yield (Proof), MPa | 260 | |
| 270 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 210 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 200 |
| Melting Completion (Liquidus), °C | 1080 | |
| 1080 |
| Melting Onset (Solidus), °C | 1080 | |
| 1030 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 390 |
| Thermal Conductivity, W/m-K | 390 | |
| 380 |
| Thermal Expansion, µm/m-K | 17 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 99 | |
| 98 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 99 | |
| 98 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 31 | |
| 32 |
| Density, g/cm3 | 9.0 | |
| 9.0 |
| Embodied Carbon, kg CO2/kg material | 2.6 | |
| 2.6 |
| Embodied Energy, MJ/kg | 41 | |
| 41 |
| Embodied Water, L/kg | 310 | |
| 330 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 38 | |
| 40 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 290 | |
| 310 |
| Stiffness to Weight: Axial, points | 7.2 | |
| 7.2 |
| Stiffness to Weight: Bending, points | 18 | |
| 18 |
| Strength to Weight: Axial, points | 8.8 | |
| 9.0 |
| Strength to Weight: Bending, points | 11 | |
| 11 |
| Thermal Diffusivity, mm2/s | 110 | |
| 110 |
| Thermal Shock Resistance, points | 10 | |
| 10 |
Alloy Composition
| Antimony (Sb), % | 0 | |
| 0 to 0.0030 |
| Arsenic (As), % | 0 | |
| 0 to 0.012 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.0030 |
| Copper (Cu), % | 99.95 to 99.999 | |
| 99.88 to 100 |
| Lead (Pb), % | 0 | |
| 0 to 0.0040 |
| Nickel (Ni), % | 0 | |
| 0 to 0.050 |
| Phosphorus (P), % | 0.0010 to 0.0050 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.054 |
| Tellurium (Te), % | 0 | |
| 0 to 0.025 |