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H02 C10400 Copper vs. H02 C49300 Brass

Both H02 C10400 copper and H02 C49300 brass are copper alloys. Both are furnished in the H02 (half hard) temper. They have 60% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is H02 C10400 copper and the bottom bar is H02 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
100
Elongation at Break, % 14
9.0
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
40
Shear Strength, MPa 170
270
Tensile Strength: Ultimate (UTS), MPa 290
460
Tensile Strength: Yield (Proof), MPa 260
410

Thermal Properties

Latent Heat of Fusion, J/g 210
170
Maximum Temperature: Mechanical, °C 200
120
Melting Completion (Liquidus), °C 1080
880
Melting Onset (Solidus), °C 1080
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 390
88
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
15
Electrical Conductivity: Equal Weight (Specific), % IACS 100
17

Otherwise Unclassified Properties

Base Metal Price, % relative 32
26
Density, g/cm3 9.0
8.0
Embodied Carbon, kg CO2/kg material 2.6
3.0
Embodied Energy, MJ/kg 42
50
Embodied Water, L/kg 340
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 38
40
Resilience: Unit (Modulus of Resilience), kJ/m3 300
800
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.8
16
Strength to Weight: Bending, points 11
17
Thermal Diffusivity, mm2/s 110
29
Thermal Shock Resistance, points 10
16

Alloy Composition


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Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0
0.5 to 2.0
Copper (Cu), % 99.9 to 99.973
58 to 62
Iron (Fe), % 0
0 to 0.1
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Oxygen (O), % 0 to 0.0010
0
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Silver (Ag), % 0.027 to 0.050
0
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 0
30.6 to 40.5
Residuals, % 0 to 0.050
0 to 0.5