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H02 C12000 Copper vs. H02 C73500 Nickel Silver

Both H02 C12000 copper and H02 C73500 nickel silver are copper alloys. Both are furnished in the H02 (half hard) temper. They have 72% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is H02 C12000 copper and the bottom bar is H02 C73500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Poisson's Ratio 0.34
0.33
Rockwell Superficial 30T Hardness 50
70
Shear Modulus, GPa 43
47
Tensile Strength: Ultimate (UTS), MPa 290
480

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
220
Melting Completion (Liquidus), °C 1080
1140
Melting Onset (Solidus), °C 1080
1090
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 390
36
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 98
6.7

Otherwise Unclassified Properties

Base Metal Price, % relative 31
35
Density, g/cm3 9.0
8.7
Embodied Carbon, kg CO2/kg material 2.6
4.0
Embodied Energy, MJ/kg 41
61
Embodied Water, L/kg 310
300

Common Calculations

Stiffness to Weight: Axial, points 7.2
8.0
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.8
15
Strength to Weight: Bending, points 11
16
Thermal Diffusivity, mm2/s 110
10
Thermal Shock Resistance, points 10
16

Alloy Composition


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Copper (Cu), % 99.9 to 99.996
70.5 to 73.5
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0
16.5 to 19.5
Phosphorus (P), % 0.0040 to 0.012
0
Zinc (Zn), % 0
5.7 to 13
Residuals, % 0
0 to 0.5