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H02 C24000 Brass vs. H02 C49300 Brass

Both H02 C24000 brass and H02 C49300 brass are copper alloys. Both are furnished in the H02 (half hard) temper. They have 80% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H02 C24000 brass and the bottom bar is H02 C49300 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
100
Elongation at Break, % 18
9.0
Poisson's Ratio 0.32
0.31
Shear Modulus, GPa 42
40
Shear Strength, MPa 270
270
Tensile Strength: Ultimate (UTS), MPa 420
460
Tensile Strength: Yield (Proof), MPa 350
410

Thermal Properties

Latent Heat of Fusion, J/g 190
170
Maximum Temperature: Mechanical, °C 160
120
Melting Completion (Liquidus), °C 1000
880
Melting Onset (Solidus), °C 970
840
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 140
88
Thermal Expansion, µm/m-K 19
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 32
15
Electrical Conductivity: Equal Weight (Specific), % IACS 34
17

Otherwise Unclassified Properties

Base Metal Price, % relative 27
26
Density, g/cm3 8.5
8.0
Embodied Carbon, kg CO2/kg material 2.6
3.0
Embodied Energy, MJ/kg 43
50
Embodied Water, L/kg 320
370

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 71
40
Resilience: Unit (Modulus of Resilience), kJ/m3 540
800
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 14
16
Strength to Weight: Bending, points 15
17
Thermal Diffusivity, mm2/s 43
29
Thermal Shock Resistance, points 14
16

Alloy Composition


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Aluminum (Al), % 0
0 to 0.5
Antimony (Sb), % 0
0 to 0.5
Bismuth (Bi), % 0
0.5 to 2.0
Copper (Cu), % 78.5 to 81.5
58 to 62
Iron (Fe), % 0 to 0.050
0 to 0.1
Lead (Pb), % 0 to 0.050
0 to 0.010
Manganese (Mn), % 0
0 to 0.030
Nickel (Ni), % 0
0 to 1.5
Phosphorus (P), % 0
0 to 0.2
Selenium (Se), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.1
Tin (Sn), % 0
1.0 to 1.8
Zinc (Zn), % 18.2 to 21.5
30.6 to 40.5
Residuals, % 0 to 0.2
0 to 0.5