H02 C66700 Brass vs. H02 C69300 Brass
Both H02 C66700 brass and H02 C69300 brass are copper alloys. Both are furnished in the H02 (half hard) temper. They have a moderately high 92% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.
For each property being compared, the top bar is H02 C66700 brass and the bottom bar is H02 C69300 brass.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 110 |
| Elongation at Break, % | 13 | |
| 8.5 |
| Poisson's Ratio | 0.31 | |
| 0.32 |
| Rockwell B Hardness | 70 | |
| 88 |
| Shear Modulus, GPa | 41 | |
| 41 |
| Shear Strength, MPa | 320 | |
| 370 |
| Tensile Strength: Ultimate (UTS), MPa | 530 | |
| 630 |
| Tensile Strength: Yield (Proof), MPa | 380 | |
| 390 |
Thermal Properties
| Latent Heat of Fusion, J/g | 180 | |
| 240 |
| Maximum Temperature: Mechanical, °C | 140 | |
| 160 |
| Melting Completion (Liquidus), °C | 1090 | |
| 880 |
| Melting Onset (Solidus), °C | 1050 | |
| 860 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 400 |
| Thermal Conductivity, W/m-K | 97 | |
| 38 |
| Thermal Expansion, µm/m-K | 20 | |
| 19 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 17 | |
| 8.0 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 19 | |
| 8.8 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 25 | |
| 26 |
| Density, g/cm3 | 8.2 | |
| 8.2 |
| Embodied Carbon, kg CO2/kg material | 2.7 | |
| 2.7 |
| Embodied Energy, MJ/kg | 45 | |
| 45 |
| Embodied Water, L/kg | 320 | |
| 310 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 60 | |
| 47 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 650 | |
| 700 |
| Stiffness to Weight: Axial, points | 7.3 | |
| 7.4 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 18 | |
| 21 |
| Strength to Weight: Bending, points | 18 | |
| 20 |
| Thermal Diffusivity, mm2/s | 30 | |
| 12 |
| Thermal Shock Resistance, points | 18 | |
| 22 |
Alloy Composition
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| Copper (Cu), % | 68.5 to 71.5 | |
| 73 to 77 |
| Iron (Fe), % | 0 to 0.1 | |
| 0 to 0.1 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.090 |
| Manganese (Mn), % | 0.8 to 1.5 | |
| 0 to 0.1 |
| Nickel (Ni), % | 0 | |
| 0 to 0.1 |
| Phosphorus (P), % | 0 | |
| 0.040 to 0.15 |
| Silicon (Si), % | 0 | |
| 2.7 to 3.4 |
| Tin (Sn), % | 0 | |
| 0 to 0.2 |
| Zinc (Zn), % | 26.3 to 30.7 | |
| 18.4 to 24.3 |
| Residuals, % | 0 to 0.5 | |
| 0 to 0.5 |