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H02 C69300 Brass vs. H02 C71500 Copper-nickel

Both H02 C69300 brass and H02 C71500 copper-nickel are copper alloys. Both are furnished in the H02 (half hard) temper. They have 68% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is H02 C69300 brass and the bottom bar is H02 C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Poisson's Ratio 0.32
0.33
Rockwell B Hardness 88
81
Shear Modulus, GPa 41
52
Tensile Strength: Ultimate (UTS), MPa 630
500

Thermal Properties

Latent Heat of Fusion, J/g 240
230
Maximum Temperature: Mechanical, °C 160
260
Melting Completion (Liquidus), °C 880
1240
Melting Onset (Solidus), °C 860
1170
Specific Heat Capacity, J/kg-K 400
400
Thermal Conductivity, W/m-K 38
28
Thermal Expansion, µm/m-K 19
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.0
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 8.8
4.7

Otherwise Unclassified Properties

Base Metal Price, % relative 26
41
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.1
Embodied Energy, MJ/kg 45
74
Embodied Water, L/kg 310
280

Common Calculations

Stiffness to Weight: Axial, points 7.4
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 21
16
Strength to Weight: Bending, points 20
16
Thermal Diffusivity, mm2/s 12
7.7
Thermal Shock Resistance, points 22
16

Alloy Composition


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Copper (Cu), % 73 to 77
63.5 to 70.6
Iron (Fe), % 0 to 0.1
0.4 to 1.0
Lead (Pb), % 0 to 0.090
0 to 0.050
Manganese (Mn), % 0 to 0.1
0 to 1.0
Nickel (Ni), % 0 to 0.1
29 to 33
Phosphorus (P), % 0.040 to 0.15
0
Silicon (Si), % 2.7 to 3.4
0
Tin (Sn), % 0 to 0.2
0
Zinc (Zn), % 18.4 to 24.3
0 to 1.0
Residuals, % 0 to 0.5
0 to 0.5