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H80 C10500 Copper vs. H80 C12000 Copper

Both H80 C10500 copper and H80 C12000 copper are copper alloys. Both are furnished in the H80 (hard drawn) temper. Their average alloy composition is basically identical. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is H80 C10500 copper and the bottom bar is H80 C12000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 8.0
7.8
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
43
Shear Strength, MPa 200
210
Tensile Strength: Ultimate (UTS), MPa 380
350
Tensile Strength: Yield (Proof), MPa 370
310

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1080
Melting Onset (Solidus), °C 1080
1080
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
390
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
98
Electrical Conductivity: Equal Weight (Specific), % IACS 100
98

Otherwise Unclassified Properties

Base Metal Price, % relative 32
31
Density, g/cm3 9.0
9.0
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 42
41
Embodied Water, L/kg 350
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30
27
Resilience: Unit (Modulus of Resilience), kJ/m3 600
410
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 12
11
Strength to Weight: Bending, points 13
12
Thermal Diffusivity, mm2/s 110
110
Thermal Shock Resistance, points 13
13

Alloy Composition


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Copper (Cu), % 99.89 to 99.966
99.9 to 99.996
Oxygen (O), % 0 to 0.0010
0
Phosphorus (P), % 0
0.0040 to 0.012
Silver (Ag), % 0.034 to 0.060
0
Residuals, % 0 to 0.050
0