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Solder Alloy 102 vs. C70400 Copper-nickel

Solder alloy 102 belongs to the otherwise unclassified metals classification, while C70400 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 102 and the bottom bar is C70400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 38
120
Poisson's Ratio 0.39
0.34
Shear Modulus, GPa 14
45
Tensile Strength: Ultimate (UTS), MPa 31
300 to 310

Thermal Properties

Latent Heat of Fusion, J/g 46
210
Melting Completion (Liquidus), °C 180
1120
Melting Onset (Solidus), °C 180
1060
Specific Heat Capacity, J/kg-K 190
390
Thermal Conductivity, W/m-K 53
64
Thermal Expansion, µm/m-K 25
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
14
Electrical Conductivity: Equal Weight (Specific), % IACS 13
14

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 11
3.0
Embodied Energy, MJ/kg 180
47
Embodied Water, L/kg 930
300

Common Calculations

Stiffness to Weight: Axial, points 2.4
7.5
Stiffness to Weight: Bending, points 13
19
Strength to Weight: Axial, points 1.0
9.3 to 9.8
Strength to Weight: Bending, points 2.5
11 to 12
Thermal Diffusivity, mm2/s 32
18
Thermal Shock Resistance, points 2.4
10 to 11

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.050
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.050
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
89.8 to 93.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.3 to 1.7
Lead (Pb), % 36 to 37.5
0 to 0.050
Manganese (Mn), % 0
0.3 to 0.8
Nickel (Ni), % 0 to 0.010
4.8 to 6.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 62.5 to 63.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5