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Solder Alloy 104 vs. Solder Alloy 601

Both solder alloy 104 and solder alloy 601 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 104 and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 37
31
Elongation at Break, % 46
83
Poisson's Ratio 0.39
0.41
Shear Modulus, GPa 13
11
Tensile Strength: Ultimate (UTS), MPa 51
12

Thermal Properties

Latent Heat of Fusion, J/g 45
43
Melting Completion (Liquidus), °C 190
120
Melting Onset (Solidus), °C 180
120
Specific Heat Capacity, J/kg-K 180
230
Thermal Conductivity, W/m-K 50
34
Thermal Expansion, µm/m-K 25
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
12
Electrical Conductivity: Equal Weight (Specific), % IACS 11
14

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Water, L/kg 900
1330

Common Calculations

Stiffness to Weight: Axial, points 2.3
2.3
Stiffness to Weight: Bending, points 12
14
Strength to Weight: Axial, points 1.6
0.45
Strength to Weight: Bending, points 3.4
1.6
Thermal Diffusivity, mm2/s 30
20
Thermal Shock Resistance, points 4.0
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.050
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.050
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
51 to 52.5
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 39 to 40.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 59.5 to 60.5
47.5 to 48.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010