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Solder Alloy 111 vs. C72200 Copper-nickel

Solder alloy 111 belongs to the otherwise unclassified metals classification, while C72200 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 111 and the bottom bar is C72200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 33
130
Poisson's Ratio 0.4
0.33
Shear Modulus, GPa 12
48
Tensile Strength: Ultimate (UTS), MPa 41
350 to 580

Thermal Properties

Latent Heat of Fusion, J/g 41
220
Melting Completion (Liquidus), °C 220
1180
Melting Onset (Solidus), °C 180
1120
Specific Heat Capacity, J/kg-K 180
400
Thermal Conductivity, W/m-K 48
34
Thermal Expansion, µm/m-K 26
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 11
6.6

Otherwise Unclassified Properties

Density, g/cm3 9.3
8.9
Embodied Carbon, kg CO2/kg material 9.4
3.9
Embodied Energy, MJ/kg 160
59
Embodied Water, L/kg 830
300

Common Calculations

Stiffness to Weight: Axial, points 2.0
8.0
Stiffness to Weight: Bending, points 12
19
Strength to Weight: Axial, points 1.2
11 to 18
Strength to Weight: Bending, points 2.8
12 to 17
Thermal Diffusivity, mm2/s 29
9.6
Thermal Shock Resistance, points 3.5
12 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0.3 to 0.7
Copper (Cu), % 0 to 0.080
78.1 to 84.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.0
Lead (Pb), % 48.8 to 50.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
15 to 18
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 49.5 to 50.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.2