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Solder Alloy 113 vs. ASTM B563 Pd-Ag-Cu

Both solder alloy 113 and ASTM B563 Pd-Ag-Cu are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is ASTM B563 Pd-Ag-Cu.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
100
Elongation at Break, % 32
7.0 to 17
Poisson's Ratio 0.4
0.37
Shear Modulus, GPa 11
37
Tensile Strength: Ultimate (UTS), MPa 39
760 to 1170

Thermal Properties

Latent Heat of Fusion, J/g 40
150
Melting Completion (Liquidus), °C 230
1180
Melting Onset (Solidus), °C 180
1030
Specific Heat Capacity, J/kg-K 170
260
Thermal Expansion, µm/m-K 26
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
5.6 to 6.7
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
4.6 to 5.5

Otherwise Unclassified Properties

Density, g/cm3 9.5
11

Common Calculations

Stiffness to Weight: Axial, points 1.8
5.2
Stiffness to Weight: Bending, points 11
14
Strength to Weight: Axial, points 1.1
19 to 30
Strength to Weight: Bending, points 2.7
17 to 22
Thermal Shock Resistance, points 3.4
39 to 61

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
15.5 to 16.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 53.4 to 55.5
0
Nickel (Ni), % 0 to 0.010
0.8 to 1.2
Palladium (Pd), % 0
43 to 45
Platinum (Pt), % 0
0.8 to 1.2
Silver (Ag), % 0 to 0.1
37 to 39
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.4