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Solder Alloy 113 vs. Nickel 200

Solder alloy 113 belongs to the otherwise unclassified metals classification, while nickel 200 belongs to the nickel alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is nickel 200.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
180
Elongation at Break, % 32
23 to 44
Poisson's Ratio 0.4
0.31
Shear Modulus, GPa 11
70
Tensile Strength: Ultimate (UTS), MPa 39
420 to 540

Thermal Properties

Latent Heat of Fusion, J/g 40
290
Melting Completion (Liquidus), °C 230
1460
Melting Onset (Solidus), °C 180
1440
Specific Heat Capacity, J/kg-K 170
450
Thermal Conductivity, W/m-K 46
69
Thermal Expansion, µm/m-K 26
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
18
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
18

Otherwise Unclassified Properties

Density, g/cm3 9.5
8.9
Embodied Carbon, kg CO2/kg material 8.9
11
Embodied Energy, MJ/kg 150
150
Embodied Water, L/kg 800
230

Common Calculations

Stiffness to Weight: Axial, points 1.8
11
Stiffness to Weight: Bending, points 11
21
Strength to Weight: Axial, points 1.1
13 to 17
Strength to Weight: Bending, points 2.7
14 to 17
Thermal Diffusivity, mm2/s 28
17
Thermal Shock Resistance, points 3.4
13 to 16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 0 to 0.080
0 to 0.25
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 53.4 to 55.5
0
Manganese (Mn), % 0
0 to 0.35
Nickel (Ni), % 0 to 0.010
99 to 100
Silicon (Si), % 0
0 to 0.35
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0