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Solder Alloy 113 vs. C70600 Copper-nickel

Solder alloy 113 belongs to the otherwise unclassified metals classification, while C70600 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is C70600 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
120
Elongation at Break, % 32
3.0 to 34
Poisson's Ratio 0.4
0.34
Shear Modulus, GPa 11
46
Tensile Strength: Ultimate (UTS), MPa 39
290 to 570

Thermal Properties

Latent Heat of Fusion, J/g 40
220
Melting Completion (Liquidus), °C 230
1150
Melting Onset (Solidus), °C 180
1100
Specific Heat Capacity, J/kg-K 170
390
Thermal Conductivity, W/m-K 46
44
Thermal Expansion, µm/m-K 26
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
9.9

Otherwise Unclassified Properties

Density, g/cm3 9.5
8.9
Embodied Carbon, kg CO2/kg material 8.9
3.4
Embodied Energy, MJ/kg 150
51
Embodied Water, L/kg 800
300

Common Calculations

Stiffness to Weight: Axial, points 1.8
7.7
Stiffness to Weight: Bending, points 11
19
Strength to Weight: Axial, points 1.1
9.1 to 18
Strength to Weight: Bending, points 2.7
11 to 17
Thermal Diffusivity, mm2/s 28
13
Thermal Shock Resistance, points 3.4
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
84.7 to 90
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.0 to 1.8
Lead (Pb), % 53.4 to 55.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
9.0 to 11
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5