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Solder Alloy 113 vs. C71500 Copper-nickel

Solder alloy 113 belongs to the otherwise unclassified metals classification, while C71500 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
140
Poisson's Ratio 0.4
0.33
Shear Modulus, GPa 11
52
Tensile Strength: Ultimate (UTS), MPa 39
380 to 620

Thermal Properties

Latent Heat of Fusion, J/g 40
230
Melting Completion (Liquidus), °C 230
1240
Melting Onset (Solidus), °C 180
1170
Specific Heat Capacity, J/kg-K 170
400
Thermal Conductivity, W/m-K 46
28
Thermal Expansion, µm/m-K 26
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
4.7

Otherwise Unclassified Properties

Density, g/cm3 9.5
8.9
Embodied Carbon, kg CO2/kg material 8.9
5.1
Embodied Energy, MJ/kg 150
74
Embodied Water, L/kg 800
280

Common Calculations

Stiffness to Weight: Axial, points 1.8
8.6
Stiffness to Weight: Bending, points 11
19
Strength to Weight: Axial, points 1.1
12 to 19
Strength to Weight: Bending, points 2.7
13 to 18
Thermal Diffusivity, mm2/s 28
7.7
Thermal Shock Resistance, points 3.4
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
63.5 to 70.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.4 to 1.0
Lead (Pb), % 53.4 to 55.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5