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Solder Alloy 113 vs. C99500 Copper

Solder alloy 113 belongs to the otherwise unclassified metals classification, while C99500 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is C99500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
120
Elongation at Break, % 32
13
Poisson's Ratio 0.4
0.34
Shear Modulus, GPa 11
45
Tensile Strength: Ultimate (UTS), MPa 39
540

Thermal Properties

Latent Heat of Fusion, J/g 40
240
Melting Completion (Liquidus), °C 230
1090
Melting Onset (Solidus), °C 180
1040
Specific Heat Capacity, J/kg-K 170
400
Thermal Expansion, µm/m-K 26
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
10
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
10

Otherwise Unclassified Properties

Density, g/cm3 9.5
8.7
Embodied Carbon, kg CO2/kg material 8.9
3.0
Embodied Energy, MJ/kg 150
47
Embodied Water, L/kg 800
300

Common Calculations

Stiffness to Weight: Axial, points 1.8
7.7
Stiffness to Weight: Bending, points 11
19
Strength to Weight: Axial, points 1.1
17
Strength to Weight: Bending, points 2.7
17
Thermal Shock Resistance, points 3.4
19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0.5 to 2.0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
82.5 to 92
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
3.0 to 5.0
Lead (Pb), % 53.4 to 55.5
0 to 0.25
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
3.5 to 5.5
Silicon (Si), % 0
0.5 to 2.0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 44.5 to 45.5
0
Zinc (Zn), % 0 to 0.0010
0.5 to 2.0
Residuals, % 0
0 to 0.3