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Solder Alloy 115 vs. ASTM B540 Palladium

Both solder alloy 115 and ASTM B540 palladium are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (13, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is ASTM B540 palladium.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
110
Elongation at Break, % 22
1.1 to 14
Poisson's Ratio 0.41
0.38
Shear Modulus, GPa 10
39
Tensile Strength: Ultimate (UTS), MPa 36
830 to 1240

Thermal Properties

Latent Heat of Fusion, J/g 36
140
Melting Completion (Liquidus), °C 250
1220
Melting Onset (Solidus), °C 180
1020
Specific Heat Capacity, J/kg-K 160
240
Thermal Expansion, µm/m-K 27
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
4.9 to 5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
3.5 to 3.9

Otherwise Unclassified Properties

Density, g/cm3 9.9
13

Common Calculations

Stiffness to Weight: Axial, points 1.6
4.7
Stiffness to Weight: Bending, points 10
12
Strength to Weight: Axial, points 1.0
18 to 27
Strength to Weight: Bending, points 2.4
15 to 20
Thermal Shock Resistance, points 3.4
41 to 61

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
13.5 to 14.5
Gold (Au), % 0 to 0.050
9.5 to 10.5
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 63.4 to 65.5
0
Nickel (Ni), % 0 to 0.010
0
Palladium (Pd), % 0
34 to 36
Platinum (Pt), % 0
9.5 to 10.5
Silver (Ag), % 0 to 0.1
29 to 31
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0.8 to 1.2
Residuals, % 0
0 to 0.3