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Solder Alloy 115 vs. Commercially Pure Palladium

Both solder alloy 115 and commercially pure palladium are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is commercially pure palladium.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
120
Elongation at Break, % 22
1.1 to 11
Poisson's Ratio 0.41
0.39
Shear Modulus, GPa 10
43
Tensile Strength: Ultimate (UTS), MPa 36
200 to 380

Thermal Properties

Latent Heat of Fusion, J/g 36
160
Melting Completion (Liquidus), °C 250
1550
Melting Onset (Solidus), °C 180
1550
Specific Heat Capacity, J/kg-K 160
240
Thermal Expansion, µm/m-K 27
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
16
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
12

Otherwise Unclassified Properties

Density, g/cm3 9.9
12

Common Calculations

Stiffness to Weight: Axial, points 1.6
5.6
Stiffness to Weight: Bending, points 10
14
Strength to Weight: Axial, points 1.0
4.5 to 8.8
Strength to Weight: Bending, points 2.4
6.2 to 9.7
Thermal Shock Resistance, points 3.4
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 63.4 to 65.5
0
Nickel (Ni), % 0 to 0.010
0
Palladium (Pd), % 0
99.8 to 100
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.2