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Solder Alloy 115 vs. Solder Alloy 116

Both solder alloy 115 and solder alloy 116 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a very high 95% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is solder alloy 116.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
12
Elastic (Young's, Tensile) Modulus, GPa 28
26
Elongation at Break, % 22
18
Poisson's Ratio 0.41
0.42
Shear Modulus, GPa 10
9.3
Tensile Strength: Ultimate (UTS), MPa 36
34

Thermal Properties

Latent Heat of Fusion, J/g 36
34
Melting Completion (Liquidus), °C 250
260
Melting Onset (Solidus), °C 180
180
Specific Heat Capacity, J/kg-K 160
160
Thermal Conductivity, W/m-K 43
41
Thermal Expansion, µm/m-K 27
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 95
90
Density, g/cm3 9.9
10
Embodied Carbon, kg CO2/kg material 7.8
7.2
Embodied Energy, MJ/kg 130
120
Embodied Water, L/kg 730
690

Common Calculations

Stiffness to Weight: Axial, points 1.6
1.5
Stiffness to Weight: Bending, points 10
9.8
Strength to Weight: Axial, points 1.0
0.94
Strength to Weight: Bending, points 2.4
2.3
Thermal Diffusivity, mm2/s 27
26
Thermal Shock Resistance, points 3.4
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 63.4 to 65.5
68.4 to 70.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 34.5 to 35.5
29.5 to 30.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010