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Solder Alloy 115 vs. Solder Alloy 123

Both solder alloy 115 and solder alloy 123 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 70% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
8.0
Elastic (Young's, Tensile) Modulus, GPa 28
18
Elongation at Break, % 22
45
Poisson's Ratio 0.41
0.44
Shear Modulus, GPa 10
6.2
Tensile Strength: Ultimate (UTS), MPa 36
28

Thermal Properties

Latent Heat of Fusion, J/g 36
26
Melting Completion (Liquidus), °C 250
310
Melting Onset (Solidus), °C 180
300
Specific Heat Capacity, J/kg-K 160
130
Thermal Conductivity, W/m-K 43
23
Thermal Expansion, µm/m-K 27
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 95
75
Density, g/cm3 9.9
11
Embodied Carbon, kg CO2/kg material 7.8
4.5
Embodied Energy, MJ/kg 130
74
Embodied Water, L/kg 730
500

Common Calculations

Stiffness to Weight: Axial, points 1.6
0.9
Stiffness to Weight: Bending, points 10
7.8
Strength to Weight: Axial, points 1.0
0.69
Strength to Weight: Bending, points 2.4
1.8
Thermal Diffusivity, mm2/s 27
16
Thermal Shock Resistance, points 3.4
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.1
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 63.4 to 65.5
93.5 to 95.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 34.5 to 35.5
4.5 to 5.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010