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Solder Alloy 115 vs. C12000 Copper

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C12000 copper belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C12000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
120
Elongation at Break, % 22
2.8 to 50
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 10
43
Tensile Strength: Ultimate (UTS), MPa 36
230 to 410

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1080
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 43
390
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
98
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
98

Otherwise Unclassified Properties

Base Metal Price, % relative 95
31
Density, g/cm3 9.9
9.0
Embodied Carbon, kg CO2/kg material 7.8
2.6
Embodied Energy, MJ/kg 130
41
Embodied Water, L/kg 730
310

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.2
Stiffness to Weight: Bending, points 10
18
Strength to Weight: Axial, points 1.0
7.2 to 13
Strength to Weight: Bending, points 2.4
9.4 to 14
Thermal Diffusivity, mm2/s 27
110
Thermal Shock Resistance, points 3.4
8.2 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
99.9 to 99.996
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 63.4 to 65.5
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.0040 to 0.012
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0