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Solder Alloy 115 vs. C16500 Copper

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C16500 copper belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
110
Elongation at Break, % 22
1.5 to 53
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 10
43
Tensile Strength: Ultimate (UTS), MPa 36
280 to 530

Thermal Properties

Latent Heat of Fusion, J/g 36
210
Melting Completion (Liquidus), °C 250
1070
Melting Onset (Solidus), °C 180
1010
Specific Heat Capacity, J/kg-K 160
380
Thermal Conductivity, W/m-K 43
250
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
60
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
61

Otherwise Unclassified Properties

Base Metal Price, % relative 95
31
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
2.6
Embodied Energy, MJ/kg 130
42
Embodied Water, L/kg 730
320

Common Calculations

Stiffness to Weight: Axial, points 1.6
7.1
Stiffness to Weight: Bending, points 10
18
Strength to Weight: Axial, points 1.0
8.6 to 17
Strength to Weight: Bending, points 2.4
11 to 16
Thermal Diffusivity, mm2/s 27
74
Thermal Shock Resistance, points 3.4
9.8 to 19

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0.6 to 1.0
Copper (Cu), % 0 to 0.080
97.8 to 98.9
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 63.4 to 65.5
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0.5 to 0.7
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.5