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Solder Alloy 115 vs. C55283 Copper

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C55283 copper belongs to the copper alloys. There are 17 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C55283 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
100
Poisson's Ratio 0.41
0.34
Shear Modulus, GPa 10
39
Tensile Strength: Ultimate (UTS), MPa 36
190

Thermal Properties

Latent Heat of Fusion, J/g 36
190
Melting Completion (Liquidus), °C 250
720
Melting Onset (Solidus), °C 180
640
Specific Heat Capacity, J/kg-K 160
400
Thermal Expansion, µm/m-K 27
16

Otherwise Unclassified Properties

Density, g/cm3 9.9
8.6
Embodied Carbon, kg CO2/kg material 7.8
7.9
Embodied Energy, MJ/kg 130
120

Common Calculations

Stiffness to Weight: Axial, points 1.6
6.8
Stiffness to Weight: Bending, points 10
18
Strength to Weight: Axial, points 1.0
6.1
Strength to Weight: Bending, points 2.4
8.5
Thermal Shock Resistance, points 3.4
8.0

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
86.2 to 87.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 63.4 to 65.5
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
7.0 to 7.5
Silver (Ag), % 0 to 0.1
5.8 to 6.2
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15