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Solder Alloy 115 vs. C71000 Copper-nickel

Solder alloy 115 belongs to the otherwise unclassified metals classification, while C71000 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 115 and the bottom bar is C71000 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 28
130
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 10
49
Tensile Strength: Ultimate (UTS), MPa 36
320 to 560

Thermal Properties

Latent Heat of Fusion, J/g 36
230
Melting Completion (Liquidus), °C 250
1200
Melting Onset (Solidus), °C 180
1150
Specific Heat Capacity, J/kg-K 160
400
Thermal Conductivity, W/m-K 43
43
Thermal Expansion, µm/m-K 27
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.8
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.9
6.6

Otherwise Unclassified Properties

Base Metal Price, % relative 95
37
Density, g/cm3 9.9
8.9
Embodied Carbon, kg CO2/kg material 7.8
4.3
Embodied Energy, MJ/kg 130
63
Embodied Water, L/kg 730
290

Common Calculations

Stiffness to Weight: Axial, points 1.6
8.2
Stiffness to Weight: Bending, points 10
19
Strength to Weight: Axial, points 1.0
10 to 18
Strength to Weight: Bending, points 2.4
12 to 17
Thermal Diffusivity, mm2/s 27
12
Thermal Shock Resistance, points 3.4
12 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
73.5 to 80.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.0
Lead (Pb), % 63.4 to 65.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
19 to 23
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 34.5 to 35.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5