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Solder Alloy 116 vs. Solder Alloy 115

Both solder alloy 116 and solder alloy 115 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have a very high 95% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
12
Elastic (Young's, Tensile) Modulus, GPa 26
28
Elongation at Break, % 18
22
Poisson's Ratio 0.42
0.41
Shear Modulus, GPa 9.3
10
Tensile Strength: Ultimate (UTS), MPa 34
36

Thermal Properties

Latent Heat of Fusion, J/g 34
36
Melting Completion (Liquidus), °C 260
250
Melting Onset (Solidus), °C 180
180
Specific Heat Capacity, J/kg-K 160
160
Thermal Conductivity, W/m-K 41
43
Thermal Expansion, µm/m-K 27
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 90
95
Density, g/cm3 10
9.9
Embodied Carbon, kg CO2/kg material 7.2
7.8
Embodied Energy, MJ/kg 120
130
Embodied Water, L/kg 690
730

Common Calculations

Stiffness to Weight: Axial, points 1.5
1.6
Stiffness to Weight: Bending, points 9.8
10
Strength to Weight: Axial, points 0.94
1.0
Strength to Weight: Bending, points 2.3
2.4
Thermal Diffusivity, mm2/s 26
27
Thermal Shock Resistance, points 3.4
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 68.4 to 70.5
63.4 to 65.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 29.5 to 30.5
34.5 to 35.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010