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Solder Alloy 116 vs. Solder Alloy 121

Both solder alloy 116 and solder alloy 121 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 85% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is solder alloy 121.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
11
Elastic (Young's, Tensile) Modulus, GPa 26
21
Elongation at Break, % 18
25
Poisson's Ratio 0.42
0.43
Shear Modulus, GPa 9.3
7.5
Tensile Strength: Ultimate (UTS), MPa 34
32

Thermal Properties

Latent Heat of Fusion, J/g 34
29
Melting Completion (Liquidus), °C 260
290
Melting Onset (Solidus), °C 180
230
Specific Heat Capacity, J/kg-K 160
140
Thermal Conductivity, W/m-K 41
31
Thermal Expansion, µm/m-K 27
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
7.4

Otherwise Unclassified Properties

Base Metal Price, % relative 90
80
Density, g/cm3 10
11
Embodied Carbon, kg CO2/kg material 7.2
5.6
Embodied Energy, MJ/kg 120
93
Embodied Water, L/kg 690
580

Common Calculations

Stiffness to Weight: Axial, points 1.5
1.1
Stiffness to Weight: Bending, points 9.8
8.6
Strength to Weight: Axial, points 0.94
0.84
Strength to Weight: Bending, points 2.3
2.1
Thermal Diffusivity, mm2/s 26
20
Thermal Shock Resistance, points 3.4
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 68.4 to 70.5
83.4 to 85.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 29.5 to 30.5
14.5 to 15.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010