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Solder Alloy 116 vs. C71640 Copper-nickel

Solder alloy 116 belongs to the otherwise unclassified metals classification, while C71640 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is C71640 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 26
140
Poisson's Ratio 0.42
0.33
Shear Modulus, GPa 9.3
52
Tensile Strength: Ultimate (UTS), MPa 34
490 to 630

Thermal Properties

Latent Heat of Fusion, J/g 34
240
Melting Completion (Liquidus), °C 260
1180
Melting Onset (Solidus), °C 180
1120
Specific Heat Capacity, J/kg-K 160
410
Thermal Conductivity, W/m-K 41
29
Thermal Expansion, µm/m-K 27
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 90
40
Density, g/cm3 10
8.9
Embodied Carbon, kg CO2/kg material 7.2
5.0
Embodied Energy, MJ/kg 120
73
Embodied Water, L/kg 690
280

Common Calculations

Stiffness to Weight: Axial, points 1.5
8.7
Stiffness to Weight: Bending, points 9.8
20
Strength to Weight: Axial, points 0.94
15 to 20
Strength to Weight: Bending, points 2.3
16 to 18
Thermal Diffusivity, mm2/s 26
8.2
Thermal Shock Resistance, points 3.4
16 to 21

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
61.7 to 67.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.7 to 2.3
Lead (Pb), % 68.4 to 70.5
0 to 0.050
Manganese (Mn), % 0
1.5 to 2.5
Nickel (Ni), % 0 to 0.010
29 to 32
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5