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Solder Alloy 116 vs. C73500 Nickel Silver

Solder alloy 116 belongs to the otherwise unclassified metals classification, while C73500 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is C73500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 26
130
Poisson's Ratio 0.42
0.33
Shear Modulus, GPa 9.3
47
Tensile Strength: Ultimate (UTS), MPa 34
380 to 580

Thermal Properties

Latent Heat of Fusion, J/g 34
210
Melting Completion (Liquidus), °C 260
1140
Melting Onset (Solidus), °C 180
1090
Specific Heat Capacity, J/kg-K 160
400
Thermal Conductivity, W/m-K 41
36
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
6.7

Otherwise Unclassified Properties

Base Metal Price, % relative 90
35
Density, g/cm3 10
8.7
Embodied Carbon, kg CO2/kg material 7.2
4.0
Embodied Energy, MJ/kg 120
61
Embodied Water, L/kg 690
300

Common Calculations

Stiffness to Weight: Axial, points 1.5
8.0
Stiffness to Weight: Bending, points 9.8
19
Strength to Weight: Axial, points 0.94
12 to 19
Strength to Weight: Bending, points 2.3
13 to 18
Thermal Diffusivity, mm2/s 26
10
Thermal Shock Resistance, points 3.4
13 to 19

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
70.5 to 73.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 68.4 to 70.5
0 to 0.1
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
16.5 to 19.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 29.5 to 30.5
0
Zinc (Zn), % 0 to 0.0010
5.7 to 13
Residuals, % 0
0 to 0.5