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Solder Alloy 116 vs. C81500 Copper

Solder alloy 116 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is solder alloy 116 and the bottom bar is C81500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 12
110
Elastic (Young's, Tensile) Modulus, GPa 26
120
Elongation at Break, % 18
17
Poisson's Ratio 0.42
0.34
Shear Modulus, GPa 9.3
44
Tensile Strength: Ultimate (UTS), MPa 34
350

Thermal Properties

Latent Heat of Fusion, J/g 34
210
Melting Completion (Liquidus), °C 260
1090
Melting Onset (Solidus), °C 180
1080
Specific Heat Capacity, J/kg-K 160
390
Thermal Conductivity, W/m-K 41
320
Thermal Expansion, µm/m-K 27
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.3
82
Electrical Conductivity: Equal Weight (Specific), % IACS 8.3
83

Otherwise Unclassified Properties

Base Metal Price, % relative 90
31
Density, g/cm3 10
8.9
Embodied Carbon, kg CO2/kg material 7.2
2.6
Embodied Energy, MJ/kg 120
41
Embodied Water, L/kg 690
310

Common Calculations

Stiffness to Weight: Axial, points 1.5
7.3
Stiffness to Weight: Bending, points 9.8
18
Strength to Weight: Axial, points 0.94
11
Strength to Weight: Bending, points 2.3
12
Thermal Diffusivity, mm2/s 26
91
Thermal Shock Resistance, points 3.4
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.25
0
Cadmium (Cd), % 0 to 0.0050
0
Chromium (Cr), % 0
0.4 to 1.5
Copper (Cu), % 0 to 0.080
97.4 to 99.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 68.4 to 70.5
0 to 0.020
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 29.5 to 30.5
0 to 0.1
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5