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Solder Alloy 121 vs. Solder Alloy 115

Both solder alloy 121 and solder alloy 115 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 80% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 121 and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 11
12
Elastic (Young's, Tensile) Modulus, GPa 21
28
Elongation at Break, % 25
22
Poisson's Ratio 0.43
0.41
Shear Modulus, GPa 7.5
10
Tensile Strength: Ultimate (UTS), MPa 32
36

Thermal Properties

Latent Heat of Fusion, J/g 29
36
Melting Completion (Liquidus), °C 290
250
Melting Onset (Solidus), °C 230
180
Specific Heat Capacity, J/kg-K 140
160
Thermal Conductivity, W/m-K 31
43
Thermal Expansion, µm/m-K 28
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 80
95
Density, g/cm3 11
9.9
Embodied Carbon, kg CO2/kg material 5.6
7.8
Embodied Energy, MJ/kg 93
130
Embodied Water, L/kg 580
730

Common Calculations

Stiffness to Weight: Axial, points 1.1
1.6
Stiffness to Weight: Bending, points 8.6
10
Strength to Weight: Axial, points 0.84
1.0
Strength to Weight: Bending, points 2.1
2.4
Thermal Diffusivity, mm2/s 20
27
Thermal Shock Resistance, points 3.9
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 83.4 to 85.5
63.4 to 65.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 14.5 to 15.5
34.5 to 35.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010