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Solder Alloy 121 vs. Solder Alloy 116

Both solder alloy 121 and solder alloy 116 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 85% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 121 and the bottom bar is solder alloy 116.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 11
12
Elastic (Young's, Tensile) Modulus, GPa 21
26
Elongation at Break, % 25
18
Poisson's Ratio 0.43
0.42
Shear Modulus, GPa 7.5
9.3
Tensile Strength: Ultimate (UTS), MPa 32
34

Thermal Properties

Latent Heat of Fusion, J/g 29
34
Melting Completion (Liquidus), °C 290
260
Melting Onset (Solidus), °C 230
180
Specific Heat Capacity, J/kg-K 140
160
Thermal Conductivity, W/m-K 31
41
Thermal Expansion, µm/m-K 28
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 7.4
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 80
90
Density, g/cm3 11
10
Embodied Carbon, kg CO2/kg material 5.6
7.2
Embodied Energy, MJ/kg 93
120
Embodied Water, L/kg 580
690

Common Calculations

Stiffness to Weight: Axial, points 1.1
1.5
Stiffness to Weight: Bending, points 8.6
9.8
Strength to Weight: Axial, points 0.84
0.94
Strength to Weight: Bending, points 2.1
2.3
Thermal Diffusivity, mm2/s 20
26
Thermal Shock Resistance, points 3.9
3.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 83.4 to 85.5
68.4 to 70.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 14.5 to 15.5
29.5 to 30.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010