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Solder Alloy 122 vs. Solder Alloy 301

Both solder alloy 122 and solder alloy 301 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 122 and the bottom bar is solder alloy 301.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 10
23
Elastic (Young's, Tensile) Modulus, GPa 20
40
Elongation at Break, % 30
51
Poisson's Ratio 0.43
0.34
Shear Modulus, GPa 6.9
15
Tensile Strength: Ultimate (UTS), MPa 30
55

Thermal Properties

Latent Heat of Fusion, J/g 27
55
Melting Completion (Liquidus), °C 300
140
Melting Onset (Solidus), °C 270
140
Specific Heat Capacity, J/kg-K 140
160
Thermal Conductivity, W/m-K 25
19
Thermal Expansion, µm/m-K 28
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.9
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 7.3
4.9

Otherwise Unclassified Properties

Density, g/cm3 11
8.7
Embodied Carbon, kg CO2/kg material 5.0
13
Embodied Energy, MJ/kg 84
210

Common Calculations

Stiffness to Weight: Axial, points 1.0
2.5
Stiffness to Weight: Bending, points 8.2
13
Strength to Weight: Axial, points 0.77
1.8
Strength to Weight: Bending, points 2.0
3.7
Thermal Diffusivity, mm2/s 17
13
Thermal Shock Resistance, points 3.9
7.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
56.5 to 59
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 88.4 to 90.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 9.5 to 10.5
41 to 43
Zinc (Zn), % 0 to 0.0010
0 to 0.0010