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Solder Alloy 122 vs. Solder Alloy 601

Both solder alloy 122 and solder alloy 601 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 122 and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 10
5.0
Elastic (Young's, Tensile) Modulus, GPa 20
31
Elongation at Break, % 30
83
Poisson's Ratio 0.43
0.41
Shear Modulus, GPa 6.9
11
Tensile Strength: Ultimate (UTS), MPa 30
12

Thermal Properties

Latent Heat of Fusion, J/g 27
43
Melting Completion (Liquidus), °C 300
120
Melting Onset (Solidus), °C 270
120
Specific Heat Capacity, J/kg-K 140
230
Thermal Conductivity, W/m-K 25
34
Thermal Expansion, µm/m-K 28
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.9
12
Electrical Conductivity: Equal Weight (Specific), % IACS 7.3
14

Otherwise Unclassified Properties

Density, g/cm3 11
7.3
Embodied Water, L/kg 540
1330

Common Calculations

Stiffness to Weight: Axial, points 1.0
2.3
Stiffness to Weight: Bending, points 8.2
14
Strength to Weight: Axial, points 0.77
0.45
Strength to Weight: Bending, points 2.0
1.6
Thermal Diffusivity, mm2/s 17
20
Thermal Shock Resistance, points 3.9
1.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
0 to 0.1
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
51 to 52.5
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 88.4 to 90.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 9.5 to 10.5
47.5 to 48.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010