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Solder Alloy 123 vs. Solder Alloy 117

Both solder alloy 123 and solder alloy 117 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 85% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is solder alloy 117.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 8.0
11
Elastic (Young's, Tensile) Modulus, GPa 18
23
Elongation at Break, % 45
20
Poisson's Ratio 0.44
0.42
Shear Modulus, GPa 6.2
8.1
Tensile Strength: Ultimate (UTS), MPa 28
33

Thermal Properties

Latent Heat of Fusion, J/g 26
31
Melting Completion (Liquidus), °C 310
280
Melting Onset (Solidus), °C 300
180
Specific Heat Capacity, J/kg-K 130
150
Thermal Conductivity, W/m-K 23
37
Thermal Expansion, µm/m-K 29
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
8.7
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
7.5

Otherwise Unclassified Properties

Base Metal Price, % relative 75
85
Density, g/cm3 11
11
Embodied Carbon, kg CO2/kg material 4.5
6.1
Embodied Energy, MJ/kg 74
100
Embodied Water, L/kg 500
610

Common Calculations

Stiffness to Weight: Axial, points 0.9
1.2
Stiffness to Weight: Bending, points 7.8
9.0
Strength to Weight: Axial, points 0.69
0.88
Strength to Weight: Bending, points 1.8
2.2
Thermal Diffusivity, mm2/s 16
24
Thermal Shock Resistance, points 3.8
3.7

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 93.5 to 95.5
78.4 to 80.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 4.5 to 5.5
19.5 to 20.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010