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Solder Alloy 123 vs. Solder Alloy 121

Both solder alloy 123 and solder alloy 121 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 90% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is solder alloy 121.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 8.0
11
Elastic (Young's, Tensile) Modulus, GPa 18
21
Elongation at Break, % 45
25
Poisson's Ratio 0.44
0.43
Shear Modulus, GPa 6.2
7.5
Tensile Strength: Ultimate (UTS), MPa 28
32

Thermal Properties

Latent Heat of Fusion, J/g 26
29
Melting Completion (Liquidus), °C 310
290
Melting Onset (Solidus), °C 300
230
Specific Heat Capacity, J/kg-K 130
140
Thermal Conductivity, W/m-K 23
31
Thermal Expansion, µm/m-K 29
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
7.4

Otherwise Unclassified Properties

Base Metal Price, % relative 75
80
Density, g/cm3 11
11
Embodied Carbon, kg CO2/kg material 4.5
5.6
Embodied Energy, MJ/kg 74
93
Embodied Water, L/kg 500
580

Common Calculations

Stiffness to Weight: Axial, points 0.9
1.1
Stiffness to Weight: Bending, points 7.8
8.6
Strength to Weight: Axial, points 0.69
0.84
Strength to Weight: Bending, points 1.8
2.1
Thermal Diffusivity, mm2/s 16
20
Thermal Shock Resistance, points 3.8
3.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.25
Cadmium (Cd), % 0 to 0.0050
0 to 0.0050
Copper (Cu), % 0 to 0.080
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 93.5 to 95.5
83.4 to 85.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 4.5 to 5.5
14.5 to 15.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010