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Solder Alloy 123 vs. Solder Alloy 704

Both solder alloy 123 and solder alloy 704 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 23 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is solder alloy 704.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 8.0
14
Elastic (Young's, Tensile) Modulus, GPa 18
51
Elongation at Break, % 45
30
Poisson's Ratio 0.44
0.36
Shear Modulus, GPa 6.2
19
Tensile Strength: Ultimate (UTS), MPa 28
55

Thermal Properties

Latent Heat of Fusion, J/g 26
62
Melting Completion (Liquidus), °C 310
240
Melting Onset (Solidus), °C 300
220
Specific Heat Capacity, J/kg-K 130
220
Thermal Conductivity, W/m-K 23
50
Thermal Expansion, µm/m-K 29
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
13
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
15

Otherwise Unclassified Properties

Density, g/cm3 11
7.5
Embodied Carbon, kg CO2/kg material 4.5
19
Embodied Energy, MJ/kg 74
320

Common Calculations

Stiffness to Weight: Axial, points 0.9
3.8
Stiffness to Weight: Bending, points 7.8
17
Strength to Weight: Axial, points 0.69
2.1
Strength to Weight: Bending, points 1.8
4.3
Thermal Diffusivity, mm2/s 16
30
Thermal Shock Resistance, points 3.8
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 93.5 to 95.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
4.8 to 5.2
Tin (Sn), % 4.5 to 5.5
94.3 to 95.2
Zinc (Zn), % 0 to 0.0010
0 to 0.0010