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Solder Alloy 123 vs. C55180 Copper

Solder alloy 123 belongs to the otherwise unclassified metals classification, while C55180 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is C55180 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
110
Elongation at Break, % 45
20
Poisson's Ratio 0.44
0.34
Shear Modulus, GPa 6.2
41
Tensile Strength: Ultimate (UTS), MPa 28
200

Thermal Properties

Latent Heat of Fusion, J/g 26
200
Melting Completion (Liquidus), °C 310
920
Melting Onset (Solidus), °C 300
710
Specific Heat Capacity, J/kg-K 130
400
Thermal Conductivity, W/m-K 23
200
Thermal Expansion, µm/m-K 29
17

Otherwise Unclassified Properties

Base Metal Price, % relative 75
29
Density, g/cm3 11
8.6
Embodied Carbon, kg CO2/kg material 4.5
2.5
Embodied Energy, MJ/kg 74
39
Embodied Water, L/kg 500
290

Common Calculations

Stiffness to Weight: Axial, points 0.9
7.1
Stiffness to Weight: Bending, points 7.8
18
Strength to Weight: Axial, points 0.69
6.4
Strength to Weight: Bending, points 1.8
8.8
Thermal Diffusivity, mm2/s 16
56
Thermal Shock Resistance, points 3.8
7.9

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
94.7 to 95.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 93.5 to 95.5
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
4.8 to 5.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 4.5 to 5.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15