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Solder Alloy 123 vs. C72200 Copper-nickel

Solder alloy 123 belongs to the otherwise unclassified metals classification, while C72200 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is C72200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
130
Poisson's Ratio 0.44
0.33
Shear Modulus, GPa 6.2
48
Tensile Strength: Ultimate (UTS), MPa 28
350 to 580

Thermal Properties

Latent Heat of Fusion, J/g 26
220
Melting Completion (Liquidus), °C 310
1180
Melting Onset (Solidus), °C 300
1120
Specific Heat Capacity, J/kg-K 130
400
Thermal Conductivity, W/m-K 23
34
Thermal Expansion, µm/m-K 29
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
6.6

Otherwise Unclassified Properties

Base Metal Price, % relative 75
36
Density, g/cm3 11
8.9
Embodied Carbon, kg CO2/kg material 4.5
3.9
Embodied Energy, MJ/kg 74
59
Embodied Water, L/kg 500
300

Common Calculations

Stiffness to Weight: Axial, points 0.9
8.0
Stiffness to Weight: Bending, points 7.8
19
Strength to Weight: Axial, points 0.69
11 to 18
Strength to Weight: Bending, points 1.8
12 to 17
Thermal Diffusivity, mm2/s 16
9.6
Thermal Shock Resistance, points 3.8
12 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0050
0
Chromium (Cr), % 0
0.3 to 0.7
Copper (Cu), % 0 to 0.080
78.1 to 84.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.0
Lead (Pb), % 93.5 to 95.5
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
15 to 18
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 4.5 to 5.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.2