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Solder Alloy 123 vs. C96900 Copper-nickel

Solder alloy 123 belongs to the otherwise unclassified metals classification, while C96900 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 123 and the bottom bar is C96900 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 18
120
Elongation at Break, % 45
4.5
Poisson's Ratio 0.44
0.34
Shear Modulus, GPa 6.2
45
Tensile Strength: Ultimate (UTS), MPa 28
850

Thermal Properties

Latent Heat of Fusion, J/g 26
210
Melting Completion (Liquidus), °C 310
1060
Melting Onset (Solidus), °C 300
960
Specific Heat Capacity, J/kg-K 130
380
Thermal Expansion, µm/m-K 29
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.8
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 7.1
9.2

Otherwise Unclassified Properties

Base Metal Price, % relative 75
39
Density, g/cm3 11
8.8
Embodied Carbon, kg CO2/kg material 4.5
4.6
Embodied Energy, MJ/kg 74
72
Embodied Water, L/kg 500
360

Common Calculations

Stiffness to Weight: Axial, points 0.9
7.7
Stiffness to Weight: Bending, points 7.8
19
Strength to Weight: Axial, points 0.69
27
Strength to Weight: Bending, points 1.8
23
Thermal Shock Resistance, points 3.8
30

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0050
0
Copper (Cu), % 0 to 0.080
73.6 to 78
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 93.5 to 95.5
0 to 0.020
Magnesium (Mg), % 0
0 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0 to 0.010
14.5 to 15.5
Niobium (Nb), % 0
0 to 0.1
Silicon (Si), % 0
0 to 0.3
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 4.5 to 5.5
7.5 to 8.5
Zinc (Zn), % 0 to 0.0010
0 to 0.5
Residuals, % 0
0 to 0.5