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Solder Alloy 124 vs. Solder Alloy 502

Both solder alloy 124 and solder alloy 502 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. There are 22 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is solder alloy 124 and the bottom bar is solder alloy 502.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 17
53
Elongation at Break, % 46
34
Poisson's Ratio 0.44
0.36
Shear Modulus, GPa 5.8
19
Tensile Strength: Ultimate (UTS), MPa 27
58

Thermal Properties

Latent Heat of Fusion, J/g 24
66
Melting Completion (Liquidus), °C 330
350
Melting Onset (Solidus), °C 320
220
Specific Heat Capacity, J/kg-K 130
230
Thermal Conductivity, W/m-K 22
47
Thermal Expansion, µm/m-K 29
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.6
12
Electrical Conductivity: Equal Weight (Specific), % IACS 7.7
15

Otherwise Unclassified Properties

Density, g/cm3 11
7.4
Embodied Carbon, kg CO2/kg material 4.1
15
Embodied Energy, MJ/kg 68
260

Common Calculations

Stiffness to Weight: Axial, points 0.83
4.0
Stiffness to Weight: Bending, points 7.6
17
Strength to Weight: Axial, points 0.65
2.2
Strength to Weight: Bending, points 1.8
4.5
Thermal Diffusivity, mm2/s 15
28
Thermal Shock Resistance, points 3.9
3.6

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.12
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.080
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.080
3.5 to 4.5
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 97.2 to 98.2
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0.8 to 1.2
Tin (Sn), % 1.8 to 2.2
93.8 to 95.7
Zinc (Zn), % 0 to 0.0010
0 to 0.0010