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Solder Alloy 171 vs. Grade CY40 Nickel

Solder alloy 171 belongs to the otherwise unclassified metals classification, while grade CY40 nickel belongs to the nickel alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 171 and the bottom bar is grade CY40 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 38
190
Elongation at Break, % 45
34
Poisson's Ratio 0.39
0.29
Shear Modulus, GPa 14
74
Tensile Strength: Ultimate (UTS), MPa 48
540

Thermal Properties

Latent Heat of Fusion, J/g 47
330
Melting Completion (Liquidus), °C 180
1350
Melting Onset (Solidus), °C 180
1300
Specific Heat Capacity, J/kg-K 190
470
Thermal Conductivity, W/m-K 50
14
Thermal Expansion, µm/m-K 24
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 12
1.8

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.4
Embodied Carbon, kg CO2/kg material 13
9.1
Embodied Energy, MJ/kg 210
130

Common Calculations

Stiffness to Weight: Axial, points 2.4
13
Stiffness to Weight: Bending, points 13
23
Strength to Weight: Axial, points 1.5
18
Strength to Weight: Bending, points 3.3
18
Thermal Diffusivity, mm2/s 30
3.7
Thermal Shock Resistance, points 3.7
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.4
Chromium (Cr), % 0
14 to 17
Copper (Cu), % 0 to 0.080
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 11
Lead (Pb), % 34.7 to 36.7
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 0.010
67 to 86
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 3.0
Silver (Ag), % 1.8 to 2.2
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 61.5 to 62.5
0
Zinc (Zn), % 0 to 0.0010
0