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Solder Alloy 171 vs. C71500 Copper-nickel

Solder alloy 171 belongs to the otherwise unclassified metals classification, while C71500 copper-nickel belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 171 and the bottom bar is C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 38
140
Poisson's Ratio 0.39
0.33
Shear Modulus, GPa 14
52
Tensile Strength: Ultimate (UTS), MPa 48
380 to 620

Thermal Properties

Latent Heat of Fusion, J/g 47
230
Melting Completion (Liquidus), °C 180
1240
Melting Onset (Solidus), °C 180
1170
Specific Heat Capacity, J/kg-K 190
400
Thermal Conductivity, W/m-K 50
28
Thermal Expansion, µm/m-K 24
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 12
4.7

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 13
5.1
Embodied Energy, MJ/kg 210
74

Common Calculations

Stiffness to Weight: Axial, points 2.4
8.6
Stiffness to Weight: Bending, points 13
19
Strength to Weight: Axial, points 1.5
12 to 19
Strength to Weight: Bending, points 3.3
13 to 18
Thermal Diffusivity, mm2/s 30
7.7
Thermal Shock Resistance, points 3.7
12 to 20

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
63.5 to 70.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.4 to 1.0
Lead (Pb), % 34.7 to 36.7
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 61.5 to 62.5
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5