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Solder Alloy 171 vs. C72900 Copper-nickel

Solder alloy 171 belongs to the otherwise unclassified metals classification, while C72900 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 171 and the bottom bar is C72900 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 38
120
Elongation at Break, % 45
6.0 to 20
Poisson's Ratio 0.39
0.34
Shear Modulus, GPa 14
45
Tensile Strength: Ultimate (UTS), MPa 48
870 to 1080

Thermal Properties

Latent Heat of Fusion, J/g 47
210
Melting Completion (Liquidus), °C 180
1120
Melting Onset (Solidus), °C 180
950
Specific Heat Capacity, J/kg-K 190
380
Thermal Conductivity, W/m-K 50
29
Thermal Expansion, µm/m-K 24
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
7.8
Electrical Conductivity: Equal Weight (Specific), % IACS 12
8.0

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.8
Embodied Carbon, kg CO2/kg material 13
4.6
Embodied Energy, MJ/kg 210
72

Common Calculations

Stiffness to Weight: Axial, points 2.4
7.6
Stiffness to Weight: Bending, points 13
19
Strength to Weight: Axial, points 1.5
27 to 34
Strength to Weight: Bending, points 3.3
23 to 27
Thermal Diffusivity, mm2/s 30
8.6
Thermal Shock Resistance, points 3.7
31 to 38

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.2
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
74.1 to 78
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 34.7 to 36.7
0 to 0.020
Magnesium (Mg), % 0
0 to 0.15
Manganese (Mn), % 0
0 to 0.3
Nickel (Ni), % 0 to 0.010
14.5 to 15.5
Niobium (Nb), % 0
0 to 0.1
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 61.5 to 62.5
7.5 to 8.5
Zinc (Zn), % 0 to 0.0010
0 to 0.5
Residuals, % 0
0 to 0.3