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Solder Alloy 182 vs. C97300 Nickel Silver

Solder alloy 182 belongs to the otherwise unclassified metals classification, while C97300 nickel silver belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 182 and the bottom bar is C97300 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 19
110
Elongation at Break, % 37
9.0
Poisson's Ratio 0.44
0.33
Shear Modulus, GPa 6.7
40
Tensile Strength: Ultimate (UTS), MPa 28
230

Thermal Properties

Latent Heat of Fusion, J/g 28
180
Melting Completion (Liquidus), °C 370
1040
Melting Onset (Solidus), °C 300
1010
Specific Heat Capacity, J/kg-K 130
370
Thermal Conductivity, W/m-K 27
29
Thermal Expansion, µm/m-K 29
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.6
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 7.6
6.3

Otherwise Unclassified Properties

Density, g/cm3 11
8.6
Embodied Carbon, kg CO2/kg material 9.0
3.7
Embodied Energy, MJ/kg 140
59

Common Calculations

Stiffness to Weight: Axial, points 0.95
7.0
Stiffness to Weight: Bending, points 7.9
18
Strength to Weight: Axial, points 0.69
7.6
Strength to Weight: Bending, points 1.8
9.8
Thermal Diffusivity, mm2/s 18
9.3
Thermal Shock Resistance, points 3.7
8.0

Alloy Composition


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Aluminum (Al), % 0 to 0.0010
0 to 0.0050
Antimony (Sb), % 0 to 0.2
0 to 0.35
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.080
53 to 58
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 1.5
Lead (Pb), % 93.2 to 95
8.0 to 11
Nickel (Ni), % 0 to 0.010
11 to 14
Phosphorus (P), % 0
0 to 0.050
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 5.0 to 6.0
0
Sulfur (S), % 0
0 to 0.080
Tin (Sn), % 0 to 0.25
1.5 to 3.0
Zinc (Zn), % 0 to 0.0010
17 to 25
Residuals, % 0
0 to 1.0