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Solder Alloy 201 vs. CC755S Brass

Solder alloy 201 belongs to the otherwise unclassified metals classification, while CC755S brass belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 201 and the bottom bar is CC755S brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 13
110
Elastic (Young's, Tensile) Modulus, GPa 50
100
Elongation at Break, % 38
9.5
Poisson's Ratio 0.35
0.31
Shear Modulus, GPa 19
40
Tensile Strength: Ultimate (UTS), MPa 41
390

Thermal Properties

Latent Heat of Fusion, J/g 64
170
Melting Completion (Liquidus), °C 240
820
Melting Onset (Solidus), °C 240
780
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 28
120
Thermal Expansion, µm/m-K 21
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
27
Electrical Conductivity: Equal Weight (Specific), % IACS 15
30

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.1
Embodied Carbon, kg CO2/kg material 15
2.7
Embodied Energy, MJ/kg 250
46
Embodied Water, L/kg 1320
330

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.1
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.6
14
Strength to Weight: Bending, points 3.6
15
Thermal Diffusivity, mm2/s 17
38
Thermal Shock Resistance, points 2.7
13

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0.4 to 0.7
Antimony (Sb), % 4.5 to 5.5
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
59.5 to 61
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.050 to 0.2
Lead (Pb), % 0 to 0.070
1.2 to 1.7
Manganese (Mn), % 0
0 to 0.050
Nickel (Ni), % 0 to 0.010
0 to 0.2
Silicon (Si), % 0
0 to 0.050
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 94 to 95.5
0 to 0.3
Zinc (Zn), % 0 to 0.0010
35.8 to 38.9